INtelligent, Fast, Interconnected and Efficient devices for Frontier Exploitation in Research and Industry

FOR ASTROPHYSICS, MEDICAL PHYSICS AND PARTICLE PHYSICS

Description and Objectives

Work Packages

 

The WP2 purpose is to make use or contribute to develop advanced technology in order to have the FEE or local intelligence ASIC closely embedded on the near detector element.

  • This will eliminate wire or bump bonding
  • improve the performance (less noise & material for instance)
  • build more compact devices.

The main ITN interest is in developing expertise on packaging based on 3D TSV technologies and keeping an eye opened on possible alternative developed by advanced high tech industries.

INFIERI will develop some of applications in collaboration with key industrial firms associated with this project.

Partners & Coordinators

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